US20210407888 - Modular microchannel thermal solutions for integrated circuit devices A microfluidic device having a channel within a first material to thermally couple with an IC die. The channel defines an initial fluid path between a fluid inlet port and a fluid outlet port. A second material is within a portion of the channel. 4 million published international patent applications (PCT). The next PCT publication 28/2026 is scheduled for Thursday, July 9. Two-phase microchannel heat exchangers for cooling integrated circuit (IC) dies and cooling systems employing the same are disclosed.
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